Microelectromechanical structure (MEMS) monitoring
US8513948B2 · kind B2 · utility
0Cited by
7References
21Claims
0Family size
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Key dates
| Filing date | Nov 22, 2010 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Oct 1, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0118
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS component is monitored to determine its status. Sensors are deployed to sense the MEMS component and produce detection signals that are analyzed to determine the MEMS component state. An indicator device alerts a user of the status, particularly if the MEMS component has failed. Additionally, the MEMS component monitoring system may be practiced as a design structure encoded on computer readable storage media as part of a circuit design system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.