Semiconductor device and method of testing the same
US8513970B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2009 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Aug 14, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/3012
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor device (1) includes a semiconductor wafer (11) on which a plurality of semiconductor chip forming regions (1A) is formed, a circuit section (12) which is provided within each of the semiconductor chip forming regions (1A) of the semiconductor wafer (11), a control circuit section (14), provided within each of the semiconductor chip forming regions (1A) and connected to the circuit section (12), that controls electric power supplied to the circuit section (12), a power supply line (18) connected to the plurality of control circuit section (14), and a reference power line (17) connected to the plurality of control circuit section (14). In each of the control circuit sections (14), a voltage of electric power supplied from the power supply line (18) is controlled on the basis of a reference voltage from the reference power line (17).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.