Patent · US Active

Single-layer metallization and via-less metamaterial structures

US8514146B2 · kind B2 · utility

4Cited by
41References
34Claims
0Family size

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Inventors

Key dates

Filing dateOct 13, 2008
Grant dateAug 20, 2013
Priority date—
Expiry dateJun 24, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01Q5/307
  • WIPO fieldTelecommunications
  • WIPO sectorElectrical engineering

Abstract

Techniques and apparatus based on metamaterial structures provided for antenna and transmission line devices, including single-layer metallization and via-less metamaterial structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.