In-molded capacitive switch
US8514545B2 · kind B2 · utility
14Cited by
74References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 18, 2008 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Nov 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An article of manufacture having an in-molded capacitive switch and method of making the same are shown and described. In one disclosed method, a conductive ink sensing zone is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.