Heat dissipating apparatus
US8514574B2 · kind B2 · utility
5Cited by
7References
19Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 2, 2011 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Jan 15, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating apparatus comprises a base, an air duct, and a cooling fan. The base comprises a first cooling portion and a second cooling portion. The air duct covers the first cooling portion, and defines an air inlet and an air outlet. The cooling fan is secured to the first cooling portion, and located below the air inlet. A blocking board is secured between the first cooling portion and the second cooling portion to prevent air flowing from the first cooling portion to the second cooling portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.