Multimodal cooling apparatus for an electronic system
US8514575B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2010 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Oct 27, 2031 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D2021/0031
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An apparatus is provided for cooling an electronic system, which includes one or more electronic components across which air passing through the system flows. A cooling unit provides, via a coolant loop, system coolant to cool the electronic component(s), and to an air-to-liquid heat exchanger is coupled to the coolant loop downstream of the electronic component(s) to cool, in primary, liquid-cooling mode, air passing through the system. In primary, liquid-cooling mode, the cooling unit provides cooled system coolant to cool the electronic component(s), and provides system coolant to the air-to-liquid heat exchanger to cool at least a portion of air passing through the electronic system, and in a secondary, air-cooling mode, system coolant flows from cooling the electronic component(s) to the air-to-liquid heat exchanger for rejecting, via the system coolant, heat from the electronic component(s) to air passing across the air-to-liquid heat exchanger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.