Conductive structure
US8514587B2 · kind B2 · utility
37Cited by
2References
9Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 15, 2010 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Apr 10, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a conductive structure. The conductive structure includes a first conductive layer, a conductive unit, a circuit board and a conductive material. The conductive unit is disposed on the first conductive layer. The circuit board having a first through hole is disposed on the first conductive layer. The conductive unit is exposed to the first through hole. The first through hole is filled with a conductive material, such that the conductive material is electrically connected to the conductive unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.