Soldering structure and method using Zn
US8517249B2 · kind B2 · utility
2Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2007 |
| Grant date | Aug 27, 2013 |
| Priority date | — |
| Expiry date | Sep 5, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12493
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering structure using Zn includes a bonding layer which contains Zn; and a lead-free solder which bonds and reacts to the bonding layer. The bonding layer can be a Zn alloy layer or a multilayer including a Zn layer. Accordingly, the characteristics of the soldering structure can be improved by involving the high reactive Zn to the interfacial reaction of the soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.