Bimetallic integrated on-chip thermocouple array
US8517605B2 · kind B2 · utility
2Cited by
9References
23Claims
0Family size
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Key dates
| Filing date | Sep 20, 2010 |
| Grant date | Aug 27, 2013 |
| Priority date | — |
| Expiry date | Nov 10, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/028
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit chip is defined by a stack of several interconnected layers. The integrated circuit chip includes at least two layers of dissimilar metal patterned to define an array of integrated bimetallic thermocouples.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.