Tin plating method
US8518230B2 · kind B2 · utility
1Cited by
9References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 13, 2005 |
| Grant date | Aug 27, 2013 |
| Priority date | — |
| Expiry date | Sep 15, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12722
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of reducing tin whisker formation including steps of a) providing a tin or tin-alloy bath containing one or more sources of tin and one or more crystal plane orientation enhancing compounds selected from imides, imines, amides, polyamides, amines, polyamines, polyols, dibutyl thiourea, allyl thiourea, amino thiazole, rhodanine, sulfosalicylic acid and sulfamides; and b) electrodepositing a layer of tin or tin-alloy on a substrate, the tin or tin-alloy layer is free of crystal planes or equivalent planes thereof forming an angle of 5° to 22° with an adjacent crystal plane or an equivalent plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.