Acid-resistance promoting composition
US8518281B2 · kind B2 · utility
0Cited by
32References
9Claims
0Family size
Inventors
Key dates
| Filing date | Jun 3, 2008 |
| Grant date | Aug 27, 2013 |
| Priority date | — |
| Expiry date | Jun 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composition for providing acid resistance to copper surfaces in the production of multilayered printed circuit boards. The composition comprises an acid, an oxidizer, a five-membered heterocyclic compound and a thiophosphate or a phosphorous sulfide compound. In a preferred embodiment, the phosphorous compound is phosphorus pentasulfide. The composition is applied to a copper or copper alloy substrate and the copper substrate is thereafter bonded to a polymeric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.