Plasma treatment apparatus and method for plasma-assisted treatment of substrates
US8518284B2 · kind B2 · utility
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25Claims
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Key dates
| Filing date | Apr 30, 2009 |
| Grant date | Aug 27, 2013 |
| Priority date | — |
| Expiry date | Jan 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/0206
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A remote plasma source comprises a first plate-like electrode (7s) and a second plate-like electrode (7b) which are arranged in parallelism and mutually electrically DC isolated. The two electrodes (7s, 7b) are operationally connected to an Rf generator (11). The first electrode (7s) has a surface which is freely exposed to a substrate holder (3) and has a pattern of through-openings (19) distributed along its surface extent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.