Method of forming encapsulation substrate for an organic light emitting diode display device
US8518727B2 · kind B2 · utility
12Cited by
2References
21Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 14, 2013 |
| Grant date | Aug 27, 2013 |
| Priority date | — |
| Expiry date | Feb 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/3026
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An organic light emitting diode (OLED) display device and method of fabrication that includes a substrate having a device region, an outer dam region and an encapsulation region. The encapsulation region includes an inner dam region, an outer dam region and an encapsulation region that correspond to the device region. An encapsulation agent is formed in the encapsulation region of the encapsulation substrate, and filling dams are formed of the same material in the outer dam region and the inner dam region of the encapsulation substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.