Magnetic instrument pickup
US8519251B2 · kind B2 · utility
2Cited by
9References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 29, 2010 |
| Grant date | Aug 27, 2013 |
| Priority date | — |
| Expiry date | Apr 25, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG10H3/181
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
An instrument pickup including a stack of thin laminated printed circuit boards. Each layer includes an etched coil conductor structure with narrow lines and spaces defining the coil structure. The layers are connected via through holes. The etched lines are smaller than the insulated copper wire (also sometimes called magnetic wire) of a conventional instrument pickup, which means that the size, volume and/or height of the pickup may be reduced relative to a conventional wire wound instrument pickup.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.