Patent · US Active

Method for producing an electronic module

US8520396B2 · kind B2 · utility

39Cited by

3References

21Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Manuela Schmidt · Echterdingen, DE
Axel Franke · Ditzingen, DE
Sven Zinober · Friolzheim, DE

Key dates

Filing date	Feb 19, 2010
Grant date	Aug 27, 2013
Priority date	—
Expiry date	Jan 15, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49208
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing an electronic module, in that at least one first microelectronic component is provided and is electrically connected to a second microelectronic component by a first flip-chip method step; at least one dielectric component is provided which has at least one printed circuit trace, and at least one printed circuit trace of the dielectric component is electrically connected to the second microelectronic component; and the second microelectronic component is electrically connected by a second flip-chip method step to a printed circuit board by way of the printed circuit trace(s) of the dielectric component, in order to avoid vias through a microelectronic component; the invention also relates to a corresponding electronic module.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.