Laser shock peening measurement system and method
US8520470B2 · kind B2 · utility
4Cited by
4References
12Claims
0Family size
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Key dates
| Filing date | May 24, 2010 |
| Grant date | Aug 27, 2013 |
| Priority date | — |
| Expiry date | Oct 31, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K17/003
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of monitoring laser shock peening of a material includes forming an ablative layer on the material, directing the laser beam at the ablative layer to produce an acoustic wave in the material, converting the acoustic wave in the material to thermal energy external to the material and measuring the thermal energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.