Methods of maintaining and using a high concentration of dissolved copper on the surface of a useful article
US8522585B1 · kind B1 · utility
2Cited by
22References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2007 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | May 4, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12993
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
A method for maintaining and using a high concentration of dissolved copper on a surface of a useful article by providing a copper surface without coatings thereon which increase the wetting angle and which isolate the copper surface and which has a surface roughness between 2 and 50 micro inches Ra, so as to kill microbes thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.