Gas-assisted laser ablation
US8524139B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2010 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | Dec 3, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M5/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved method for laser processing that prevents material redeposition during laser ablation but allows material to be removed at a high rate. In a preferred embodiment, laser ablation is performed in a chamber filled with high pressure precursor (etchant) gas so that sample particles ejected during laser ablation will react with the precursor gas in the gas atmosphere of the sample chamber. When the ejected particles collide with precursor gas particles, the precursor is dissociated, forming a reactive component that binds the ablated material. In turn, the reaction between the reactive dissociation by-product and the ablated material forms a new, volatile compound that can be pumped away in a gaseous state rather than redepositing onto the sample.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.