Silicon-based hardmask composition and process of producing semiconductor integrated circuit device using the same
US8524851B2 · kind B2 · utility
12Cited by
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15Claims
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Key dates
| Filing date | Jul 12, 2010 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | Jul 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A silicon-based hardmask composition, including an organosilane polymer represented by Formula 1:{(SiO1.5—Y—SiO1.5)x(R3SiO1.5)y(XSiO1.5)z}(OH)e(OR6)f (1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.