Printed substrate through which very strong currents can pass and corresponding production method
US8525043B2 · kind B2 · utility
2Cited by
5References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 13, 2007 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | May 8, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
On a printed circuit or substrate board (10) designed to receive electronic components and having conductive tracks (12) printed on said board, one or more conductive bars (18) are provided that are mounted one after another between conductive link surfaces (140, 142, 144), the conductive bars (18) being electrically interconnected during a subsequent soldering process that is either a wave soldering process or a soldering process in a reflow oven.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.