LED package, method for manufacturing LED package, and packing member for LED package
US8525202B2 · kind B2 · utility
3Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2010 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | Mar 8, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.