Semiconductor device
US8525294B2 · kind B2 · utility
0Cited by
11References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2009 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | Sep 16, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package-on-package includes a semiconductor package, and a coil provided at the semiconductor package. The semiconductor package includes a bottom face, and a solder ball protruded from the bottom face. An axis of the coil is inclined with respect to the normal line of the bottom face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.