Supporting structure module and electronic device using the same
US8526171B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2011 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | Jan 13, 2032 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16M2200/022
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
This disclosure provides a supporting structure module and an electronic device using the same. The supporting structure module in the invention is used in the electronic device. The electronic device includes a first casing, a hinge, and a second casing rotatable relative to the first casing via the hinge. The supporting structure module includes a first supporting structure, and the first supporting structure includes a first bracket and a first hinge cover. The first bracket is fixed to and exposed from the first casing. The first hinge cover is connected with the first bracket by integral forming, and the first hinge cover is exposed from the first casing and covers a part of the hinge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.