Fan for cooling multiple processors housed in a sub-chassis
US8526177B2 · kind B2 · utility
0Cited by
10References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2010 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | Dec 17, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chassis comprises a printed circuit board (PCB) and a sub-chassis housing multiple processors that couple to the PCB. The sub-chassis is disposed above and parallel to the PCB. The multiple processors are cooled by a fan disposed on the sub-chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.