Devices having a thermal interface and methods of forming the same
US8526184B2 · kind B2 · utility
6Cited by
36References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2009 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | Jun 29, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20709
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conduction-cooled enclosure comprises a card guide having a card guide channel, at least one controlled-volume cavity in the card guide channel, and a thermal interface material (TIM) in the at least one controlled-volume cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.