Methods and systems for dynamically generating tailored laser pulses
US8526473B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2008 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | Jul 17, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/0057
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. The temporal pulse profile includes a first portion that defines a first time duration, and a second portion that defines a second time duration. A method includes generating a laser pulse based on laser system input parameters configured to shape the laser pulse according to the temporal pulse profile, detecting the generated laser pulse, comparing the generated laser pulse to the temporal pulse profile, and adjusting the laser system input parameters based on the comparison.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.