Semiconductor chip and method for manufacturing a semiconductor chip
US8526476B2 · kind B2 · utility
9Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2008 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | Nov 13, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/841
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor chip with a semiconductor body has a semiconductor layer sequence with an active region provided for generating radiation. A mirror structure that includes a mirror layer and a dielectric layer that is arranged at least in regions between the mirror layer and semiconductor body is arranged on the semiconductor body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.