Patent · US Active

Serial communications links with bonded first-in-first-out buffer circuitry

US8527677B1 · kind B1 · utility

3Cited by

24References

20Claims

0Family size

Assignee

Altera Corporation · US

Inventors

Frédéric Richard · Grasse, FR
Lambertus Andrianus Marinus De Jong · Wantage, GB

Key dates

Filing date	Jun 25, 2010
Grant date	Sep 3, 2013
Priority date	—
Expiry date	Oct 29, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH04L49/90
WIPO fieldDigital communication
WIPO sectorElectrical engineering

Abstract

Serial communications circuitry is provided that has bonded first-in-first-out (FIFO) buffer circuitry. The circuitry may include state machine and barrel shifter circuitry that conveys data between the bonded FIFO circuitry and a bonded serial communications path. The bonded FIFO circuitry and the bonded lane may increase the efficiency of the serial communications circuitry by reducing the number of empty data bytes buffered in the FIFO circuitry and conveyed over the serial communications path.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.