Method of manufacturing an ultrasound imaging transducer acoustic stack with integral electrical connections
US8528174B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2012 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Nov 8, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1082
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Ultrasound transducers can be fabricated by bonding a block of piezoelectric material having a conductive coating to a flex circuit that has a conductive region and at least 20 conductive traces disposed on an insulating substrate. The block of piezoelectric material is then diced so as to cut all the way through the block of piezoelectric material and all the way through the conductive region, and part way through, but not completely through, the insulating substrate. The dicing is performed so that the first conductive region is divided into at least 20 regions that are electrically isolated from each other, and each of the at least 20 regions is in electrical contact with a respective one of the at least 20 conductive traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.