Methods of fabricating a polycrystalline diamond structure
US8529649B2 · kind B2 · utility
10Cited by
96References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 12, 2011 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Sep 12, 2031 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16C33/26
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
In an embodiment, a method of fabricating a polycrystalline diamond structure includes forming an assembly including a sintered polycrystalline diamond body positioned between an aluminum-containing layer and a substrate. The method further includes subjecting the assembly to a high-pressure/high-temperature process to form the polycrystalline diamond structure including a polycrystalline diamond table bonded to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.