Patent · US Active

Polycrystalline complex-shaped mesoscale components

US8530039B2 · kind B2 · utility

1Cited by
7References
19Claims
0Family size

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Key dates

Filing dateAug 3, 2009
Grant dateSep 10, 2013
Priority date
Expiry dateJan 18, 2032

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24628
  • WIPO fieldMedical technology
  • WIPO sectorInstruments

Abstract

A polycrystalline mesoscale component, formed through a process including filing a mold cavity formed in a photoresist with a mold fill, is provided with an overall length L divided into multiple segments with a second segment extending from a first segment at a nonlinear angle. The first segment has a first segment height H1 and a first segment thickness T1, while the second segment has a second segment height H2 and a second segment thickness T2, with the lesser of H1 and H2 defining a minimum segment height Hmin and the lesser of T1 and T2 defining a minimum segment thickness Tmin. The resultant component has a ratio of L:Hmin:Tmin of 20-80:1:0.5-10 where Hmin is between 5 and 500 microns. In specific instances, the nonlinear angle is acute, the multiple segments are rectilinear in cross section, and a segment thickness has an edge resolution of between 0.1 and 2 microns.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.