Positive photosensitive resin composition, cured film, protective film, interlayer insulating film, and semiconductor device and display element using the same
US8530119B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2009 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | May 20, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0226
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is:wherein R1 represents a hydrogen atom or an organic group having 1 to 4 carbon atoms, a is an integer from 1 to 3, and b is an integer from 1 to 3. Formula (2) is:wherein R2 represents a methylene group or a single bond, c is an integer from 1 to 3, and d is an integer from 1 to 3. A protective film, an interlayer insulating film, and a semiconductor device and a display element using the same are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.