Method for placing a component onto a target platform by an apparatus using a probe
US8530248B2 · kind B2 · utility
4Cited by
33References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 13, 2010 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Nov 24, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.