Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US8530250B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2009 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Sep 11, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided is a simple and low-cost method for manufacturing, in a short time, many light emitting devices wherein adhesiveness between a leadframe and a thermosetting resin composition is high. The method for manufacturing the light emitting device having a resin package (20) wherein the optical reflectivity at a wavelength of 350-800 nm after thermal curing is 70% or more and a resin section (25) and a lead (22) are formed on substantially a same surface on an outer surface (20b) has: a step of sandwiching a leadframe (21) provided with a notched section (21a) by an upper molding die (61) and a lower molding die (62); a step of transfer-molding a thermosetting resin (23) containing a light-reflecting substance (26), in a molding die (60) sandwiched by the upper molding die (61) and the lower molding die (62) and forming a resin-molded body (24) on the leadframe (21); and a step of cutting the resin-molded body (24) and the leadframe (21) along the notched section (21a).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.