Patent · US Active

Method for attaching a first carrier device to a second carrier device and micromechanical components

US8530260B2 · kind B2 · utility

0Cited by

0References

9Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Julian Gonska · Reutlingen, DE
Axel Grosse · Pfullingen, DE
Heribert Weber · Leverkusen, DE
Ralf Hausner · Reutlingen, DE

Key dates

Filing date	Apr 12, 2010
Grant date	Sep 10, 2013
Priority date	—
Expiry date	Oct 30, 2031

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/019
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for attaching a first carrier device to a second carrier device includes forming at least one first bond layer and/or solder layer on a first exterior of the first carrier device, a partial surface being framed by the at least one first bond layer and/or solder layer, and placing the first carrier device on the second carrier device and fixedly bonding or soldering the first carrier device to the second carrier device. The at least one first bond layer and/or solder layer includes a first cover area which is larger than a first contact area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.