Image sensor having metal grid with a triangular cross-section
US8530266B1 · kind B1 · utility
31Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2012 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Jul 18, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
Abstract
A backside illuminated image sensor includes a substrate layer having a frontside and a backside. An array of photosensitive pixels is disposed within the substrate layer and is sensitive to light incident through the backside of the substrate layer. A metal grid is disposed over the backside of the substrate layer. The metal grid surrounds each of the photosensitive pixels and defines optical apertures for receiving the light into the photosensitive pixels through the backside. The metal grid includes intersecting wires each having a triangular cross-section. A material layer surrounds the metal grid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.