Patent · US Active

Method for manufacturing a microelectronic device and a microelectronic device thus manufactured

US8530276B2 · kind B2 · utility

3Cited by
22References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 26, 2011
Grant dateSep 10, 2013
Priority date
Expiry dateOct 16, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/1461
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The invention pertains to a method for manufacturing a microelectronic device on a substrate comprising at least one first electrical component and one second electrical component distributed respectively in first and second levels stacked one on top of the other on the substrate, this method comprising:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.