Method for manufacturing a microelectronic device and a microelectronic device thus manufactured
US8530276B2 · kind B2 · utility
3Cited by
22References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2011 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Oct 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention pertains to a method for manufacturing a microelectronic device on a substrate comprising at least one first electrical component and one second electrical component distributed respectively in first and second levels stacked one on top of the other on the substrate, this method comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.