Print processing for patterned conductor, semiconductor and dielectric materials

US8530589B2 · kind B2 · utility

Assignee

• Kovio, Inc. · US

Inventors

• Erik C. Scher · San Francisco, US
• Steven Molesa · San Jose, US
• Joerg Rockenberger · San Jose, US
• Arvind Kamath · Los Altos, US
• Ikuo Mori · Kawasaki, JP

Key dates

• Filing date: May 2, 2008
• Grant date: Sep 10, 2013
• Expiry date: May 3, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24802
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.