Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same
US8530749B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2008 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Jan 12, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is an ultra-thin copper foil to which a carrier foil is attached, including: a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer includes a first metal A having peelability, a second metal B and a third metal C facilitating coating of the first metal, wherein the amount (a) of the first metal A is in a range of about 30 to about 89% by total weight of the peeling layer, the amount (b) of the second metal B is in a range of about 10 to about 60% by total weight of the peeling layer, and the amount (c) of the third metal C is in a range of about 1 to about 20% by total weight of the peeling layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.