Laser cutting system
US8530783B2 · kind B2 · utility
14Cited by
66References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2010 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Feb 20, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/38
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser cutting system including a chamber configured to provide a controlled environment while the laser is being used to cut a pattern into a material to reduce or eliminate heat and oxygen related changes to the mechanical characteristics of the material. A system for providing a gas to the controlled environment within the chamber, as well as a means for exhausting gas and cutting debris from the chamber is also described. A cutting mandrel that provides for flow of a shielding gas and also provides a means for dispersing a laser beam before it can produce unwanted damage to a section of tubing is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.