Optoelectronic components with adhesion agent
US8530914B2 · kind B2 · utility
0Cited by
6References
15Claims
0Family size
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Key dates
| Filing date | Jun 8, 2006 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Jun 8, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/84
Abstract
SiO2 layers are used as adhesion layers in the case of optoelectronic components. Durable adhesions can be produced with silicone rubbers. These materials normally have only an insufficient adhesive strength on materials as frequently used for optoelectronic components, such as LED modules. This then leads in further consequence to a clear reduction of the operating life of the manufactured components. These restrictions are avoided effectively by the use of the adhesion layers, endurance upon operation in damp surroundings and upon temperature change loading is substantially improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.