Encapsulated optoelectronic component and method for the production thereof

US8530928B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Karsten Heuser · Erlangen, DE
• Christian Schmid · San Diego, US
• Tilman Schlenker · Nittendorf, DE
• Peter Groeppel · Erlangen, DE

Key dates

• Filing date: Jun 19, 2009
• Grant date: Sep 10, 2013
• Expiry date: Jun 19, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K59/873

Abstract

A method for encapsulating an optoelectronic component by depositing a diffusion barrier for protection against environmental influences by means of an atmospheric pressure plasma on at least one subarea of the surface of the optoelectronic component.