Melt-processable, injection-moldable thermoplastic polymer composition and semi-conductive devices fabricated therewith
US8530929B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Jul 31, 2009 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Aug 18, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic, hydrogenated vinyl aromatic/conjugated diene block polymer composition, especially a hydrogenated styrene/butadiene triblock composition, functions well as a LED encapsulating material in that it provides one or more of optical clarity, thermal stability, ultraviolet light resistance, melt-processability and injection-moldability. The resulting LED resists deformation after setting or hardening under typical solder reflow conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.