Anti-shock method for head stack assembly
US8531797B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2012 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Mar 24, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/5582
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention directs an anti-shock method for head stack assembly which carries a slider for flying on a disk for operation, and the anti-shock method includes: inputting a constant current to a head disk interface sensor which is deposited in the slider; obtaining a changing voltage of the head disk interface sensor, which is changed with the temperature of the head disk interface sensor as the slider is shocked; outputting the changing voltage to a controller with a threshold set therein; if the changing voltage is bigger than the threshold for a specified number of times, the controller is triggered to control the head stack assembly to stop operating and load on a ramp beside the disk; while if the changing voltage is small than the threshold for said specified number of times, the controller is not be triggered and the head stack assembly still operates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.