Distributed building blocks of R-C clamping circuitry in semiconductor die core area

US8531806B2 · kind B2 · utility

Assignee

• QUALCOMM Incorporated · US

Inventors

• Reza Jalilizeinali · San Diego, US
• Evan Siansuri · San Diego, US
• Sreeker Dundigal · San Diego, US
• Eugene R. Worley · Irvine, US

Key dates

• Filing date: Jun 30, 2011
• Grant date: Sep 10, 2013
• Expiry date: Oct 19, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/4913

Abstract

A semiconductor die includes resistor-capacitor (RC) clamping circuitry for electrostatic discharge (ESD) protection of the semiconductor die. The RC clamping circuitry includes building blocks distributed in the pad ring and in the core area of the semiconductor die. The building blocks include at least one capacitor block in the core area. The RC clamping circuitry also includes chip level conductive layer connections between each of the distributed building blocks.