IC thermal management system
US8531841B2 · kind B2 · utility
7Cited by
9References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 26, 2010 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Oct 26, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/209
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a non-intrusive method for dissipating heat from open-frame DC-DC power converters where bottom side components are exposed. A thermal interface material is placed between the motherboard to which the power converter is soldered and power dissipating and temperature sensitive components on the bottom of the power converter. The thermal interface material fills the gap between the power converter components and the motherboard, thereby providing a heat conductive path for dissipating heat from the power converter to the motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.