Printed wiring board and method for producing the same
US8533943B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2009 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Mar 24, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a multilayer printed circuit board includes preparing a substrate having a first conductor circuit, forming on first circuit formed over substrate a film including cycloolefin resin such that an insulating layer including the resin is formed on substrate and first circuit, forming in insulating layer an opening exposing at least portion of first circuit, forming an electroless plating film covering surface of insulating layer including surface of insulating layer inside opening, forming on electroless film a plating resist layer having pattern exposing selected portions of electroless film, selected portions of electroless film including a second conductor circuit and a portion of electroless film covering opening, and forming an electrolytic plating film covering selected portions of electroless film such that a filled via conductor including an electrolytic material filling space in opening and that first circuit is connected to second circuit via conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.