Underfill material dispenser
US8534574B2 · kind B2 · utility
5Cited by
12References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2010 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Oct 29, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure relate to the field of depositing an underfill material between a microelectronic die and a substrate for flip-chip packages with an underfill material dispenser. In at least one embodiment, an underfill material dispenser may include a heater having a plurality of conduits. Other embodiments of the present disclosure may further include multiple dispense needle configurations, angled dispense nozzle exit conduits, conical nozzle exit conduits, and satellite traps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.