Flexible fiber to wafer interface
US8534927B1 · kind B1 · utility
26Cited by
17References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2012 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Mar 23, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An interface device includes a flexible substrate portion, a flexible cladding portion arranged on the substrate portion, a flexible single-mode waveguide portion arranged on the cladding portion including a substantially optically transparent material, a first engagement feature operative to engage a portion of a wafer, and a connector portion engaging a first distal end of the flexible substrate portion, the connector portion operative to engage a portion of an optical fiber ferrule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.