Multi-spindle chemical mechanical planarization tool
US8535118B2 · kind B2 · utility
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15References
19Claims
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Key dates
| Filing date | Sep 20, 2011 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Oct 23, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/047
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.